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Test Publications

  
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    1 - 20
of 4286 Publications Found		 Next » Last »|
Title: New PXI Module enables Combination JTAG/Boundary Scan and dynamic Functional Test
Author:GOEPEL electronic
Date:10/9/2008
Type:Product Release
Source: GOEPEL electronic
Subjects:JTAG, Boundary Scan, boundary-scan, IEEE 1149.1, scan test, PXI, functional test
Abstract: At the Embedded Systems Show (ESS), GOEPEL electronic, world class vendor of JTAG/Boundary Scan solutions compliant with IEEE Std. 1149.x, launches a new series of JTAG Digital I/O PXI modules named PXI 5396-x. The PXI 5396-x modules offer 96 ind... [more]
Title: GOEPEL electronic's Boundary Scan Software Platform SYSTEM CASCON™ automates complex Cluster Tests per IEEE1445 (DTIF)
Author:GOEPEL electronic
Date:10/9/2008
Type:Announcement
Source: GOEPEL electronic
Subjects:JTAG, Boundary Scan, boundary-scan, IEEE 1149.1, scan test, PXI, functional test
Abstract: GOEPEL electronic, world class vendor of JTAG/Boundary Scan solutions compliant with IEEE Std 1149.x, introduces a new series of intelligent tools, particularly developed for the simulation based test of circuit functionalities, within the software ... [more]
Title: New Boundary Scan fixture allows structural testing of PCI Express Plug-In Cards via IEEE1149.6
Author:GOEPEL electronic
Date:10/9/2008
Type:Product Release
Source: GOEPEL electronic
Subjects:JTAG, Boundary Scan, boundary-scan, IEEE 1149.6, scan test, PXI, functional test
Abstract: GOEPEL electronic, leading manufacturer of JTAG / Boundary Scan solutions compliant with IEEE1149.x, announces the launch of a new interface test fixture, CION Fixture™ /PCIe-x16, a further addition to the popular CION Fixture™ family. The new low c... [more]
Title: Single test system for LTE debuts
Author:EE Times Asia
Date:9/5/2008
Type:Product Release
Source: setcom wireless
Subjects:protocol analyzer, network analyzer
Abstract: setcom wireless positions its S-CORE conformance and research test environment for Long Term Evolution (LTE) protocol testing and monitoring. S-CORE is a protocol tester for LTE signalling designed from the ground up to be easy to use, provide clear... [more]
Title: Socle Adopts Atrenta's SpyGlass(R)-DFT Product
Author:Market Watch
Date:9/3/2008
Type:Announcement
Source: Atrenta
Subjects:Design for testability (DFT) tool
Abstract: Atrenta Inc., the leading provider of Early Design Closure(R) solutions to radically improve design efficiency throughout the IC design flow, today announced that Socle Technology Corporation, a leading SoC design services company in Taiwan, has ado... [more]
Title: TI driving development, ratification of IEEE 1149.7 embedded system standard
Author:Ann Steffora Mutschler, Senior Editor -- Electronic News
Date:9/2/2008
Type:Standard
Source: Texas Instruments
Subjects:boundary scan, JTAG, IEEE-1149.7
Abstract: The two-pin compact test and debug solution is meant to reduce strict pin-count, package size and power constraints, TI says. To allow developers to easily test and debug products with complex digital circuitry, multiple CPUs and applications softw... [more]
Title: Geotest Releases ATEasy Version 7.0
Author:Geotest-Marvin Test Systems, Inc
Date:9/2/2008
Type:Product Release
Source: Geotest
Subjects:controllers, ATE architecture
Abstract: Geotest-Marvin Test Systems, Inc., has announced the release of a new version of its award-winning test development software and test executive, ATEasy. Designed specifically for the development and deployment of Test and Measurement applications, ... [more]
Title: ANSI Mezzanine Modules Provide Instrument Design/Replacement Flexibility
Author:Dr. Fred Harrison, Gary Guilbeaux, and David Clark, C&H Technologies
Date:9/2/2008
Type:Magazine Article
Source: C&H Technologies
Subjects:instrument bus, PXI, VXI
Abstract: More than 100 types of modules provide many instrumentation functions, and two or four single-wide modules can be mounted on a carrier for compatibility with most test system buses. This means that you can use the same pulse generator or counter/tim... [more]
Title: Sensors Accelerate Into Sports - MEMS
Author:Paul G. Schreier, Contributing Editor - Evaluation Engineering
Date:9/2/2008
Type:Magazine Article
Source: Evaluation Engineering
Subjects:sensors, MEMS
Abstract: Low-cost MEMS-based accelerometers have been part of automotive airbag systems for many years, and now multi-axis versions are being built into 3-D game controllers as well as pedometers and mobile phones. But, these transducers are not limited to c... [more]
Title: Testing the Reliability of Satellite Power Systems
Author:Robert V. Bornino, Director of Satellite Testing Services, National Technical Systems
Date:9/2/2008
Type:Magazine Article
Source: National Technical Systems
Subjects:reliability, solar power
Abstract: Solar cells take a real beating in satellite applications with circular sun-synchronous orbits: hot, cold, hot, cold, and so on. In fact, up to 40% of satellite failures may be caused by solar-cell damage. This article details the test consideration... [more]
Title: Teradyne to acquire Eagle Test Systems
Author:Test & Measurement World
Date:9/2/2008
Type:Announcement
Source: Teradyne
Subjects:ATE business
Abstract: Teradyne and Eagle Test Systems today announced that they have signed a definitive agreement under which Teradyne will acquire Eagle Test. Under the terms of the agreement, Eagle Test shareholders will receive $15.65 per share in cash. The aggregate... [more]
Title: LXI Instruments - The Killer Bs Are Coming
Author:Paul Schreier - Evaluation Engineering
Date:9/1/2008
Type:Magazine Article
Source: LXI ConneXion
Subjects:LXI instrumentation, standards
Abstract: If you're aware of LXI but haven't yet seen much advantage to using the Class C instruments, it's time to reconsider. Class B products are being introduced that add IEEE 1588 software- and hardware-supported time synchronization, making possible hig... [more]
Title: Data Acquisition Addresses Multifaceted Applications
Author:Tom Lecklider, Senior Technical Editor
Date:9/1/2008
Type:Magazine Article
Source: Evaluation Engineering
Subjects:data acquisition, digitizer
Abstract: Whether you're monitoring a nuclear fusion experiment or carbon exchange high in a rainforest canopy, a large number of instrumentation attributes are involved. We discuss several applications where less important specifications such as isolation an... [more]
Title: Using ATE for Efficient DigRF Interface Testing
Author:Richard Lathrop, Verigy - Evaluation Engineering
Date:9/1/2008
Type:Magazine Article
Source: Verigy
Subjects:digital RF testing
Abstract: This mobile phone article is all about putting analog on the RFIC rather than the baseband chip. As a result, testing the baseband device can be a completely digital process. Although at today's 312-Mb/s 3G data rate and >1 Gb/s anticipated for LTE,... [more]
Title: 10 Boundary Scan Tips Optimize Test Coverage
Author:Anthony Sparks, JTAG Technologies-Evaluation Engineering
Date:9/1/2008
Type:Magazine Article
Source: JTAG Technologies, Inc.
Subjects:boundary scan, JTAG, design for testabilty, DFT, IEEE 1149.1
Abstract: The boundary scan TAP has enhanced capabilities that extend beyond testing logic devices to programming flash memory ICs, debugging microprocessors, and driving external digital I/O modules. Here's a look at the pitfalls associated with each of thes... [more]
Title: A Good Time for MEMS-Based Oscillators
Author:Tom Lecklider, Senior Technical Editor
Date:9/1/2008
Type:Magazine Article
Source: Evaluation Engineering
Subjects:MEMS, sensors
Abstract: Quartz isn't dead yet, not by a long shot. But for less demanding applications, oscillators based on MEMS resonators are a tiny and low-cost alternative. Some MEMS-based oscillators can be integrated with CMOS circuitry while others must be separate... [more]
Title: Zeroing in on Component Reliability
Author:Tom Adams, Sonoscan - Evaluation Engineering
Date:9/1/2008
Type:Magazine Article
Source: Sonoscan
Subjects:reliability
Abstract: Plastic-packaged ICs are electrically tested so you can be sure they work properly. The question is, for how long? Acoustic microimaging allows internal packaging defects to be analyzed and ICs rejected with types of damage that may lead to long-ter... [more]
Title: Conducted Emissions Testing - A MIL-STD-461F Tutorial
Author:Steven G. Ferguson, Washington Laboratories - Evaluation Engineering
Date:9/1/2008
Type:Magazine Article
Source: Washington Laboratories
Subjects:electromagnetic compatibility, EMC
Abstract: You've got the EUT, a spectrum analyzer, a current probe, a signal generator, and a copy of MIL-STD 461F ready for some serious EMC testing. Fortunately, this article also is available to guide you through those parts of the specification that can b... [more]
Title: The Need for LXI Conformance Testing
Author:Jochen Wolle, Rohde & Schwarz, and Lynn Wheelwright, Wheelwright Enterprises
Date:9/1/2008
Type:Magazine Article
Source: Rohde & Schwarz
Subjects:conformance testing, telecommunications test
Abstract: As a user, you want any group of LXI instruments to interoperate correctly so you can simply build your test system. Conformance testing during Plugfests ensures that and is a very efficient way for a manufacturer to ensure new product compliance an... [more]
Title: New Boundary Scan Module from GOEPEL electronic extends structural Test Coverage to DIMM240 Interfaces
Author:GOEPEL electronic
Date:8/29/2008
Type:Product Release
Source: GOEPEL electronic
Subjects:JTAG, Boundary Scan, boundary-scan, IEEE 1149.1, scan test
Abstract: GOEPEL electronic, world-class vendor of JTAG/Boundary Scan solutions compliant with IEEE Std.1149.x, officially announces the market introduction of CION Module™/DIMM240 as another I/O module of the CION product family. The new digital low cost ... [more]

    1 - 20
of 4286 Publications Found		 Next » Last »|

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