The Newsletter

An A.T.E. Solutions, Inc. Internet Publication
Volume 12 Number 4 April 16, 2008



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Louis Ungar This Issue's Feature Article

Back to Definitions 

 By:  Louis Y. Ungar
Editor in Chief, The BestTest Newsletter
(Click here to skip article and go to TestNews)

Back to Definitions

 

Who in this profession hasn’t heard of DFT?  It is, of course, Design for Testability… or is it Design for Test?  Shouldn’t it be DfT?  Well, regardless, we all know what it means, so let’s not get bugged down on details.

This was exactly what I thought when we attempted to define some basic terms and get consensus from the testability professionals at the Testability Management Action Group (TMAG).  It was in a meeting of the “Beyond DFT Committee” that we first attempted to quickly glaze over simple definitions, such as DFT and BIST (Built-In Self Test).  I steadfastly defended the definitions I proposed while Dr. Scott Davidson of Sun Microsystems and Dr. Tony Ambler of the University of Texas were just as committed to their views of what DFT was and was not.  When we finally lowered our voices a few decibels, we were able to agree on the following definitions of simple testability terms:

Testability is a property of a circuit that enables one to test it easily, or in some cases to test it at all, by being able to control and observe signal nodes that are buried within the circuit.

Design for Testability (DFT) is a methodology incorporated in the design of electronic circuits which takes into consideration the post-design testing phase, and which attempts to reduce the effort and cost of testing.

Structured Design for Test (Structured DFT) is a design technique, usually for ICs, which enables tests to be created automatically or algorithmically.  One example of is the design of an IC with a scan structure that enables test for structural faults using a predefined test methodology.  While the test may be long, it can be generated without test engineering involvement and test patterns created by computer programs can ensure nearly 100% fault detection of certain fault types.

Built-In Self-Test (BIST) is a method of design – generally for ICs – whereby the mission circuit tests itself.  Though this is seldom performed strictly without additional circuitry, if the entire circuitry performing the test is contained within an IC, we call it self-test, in situ test, or built-in self-test.

Built-In Test (BIT) is similar to BIST in that it performs test of the circuit it resides in, but it is generally used at board and system levels and often uses extra hardware, software, and/or firmware to implement the test. When the added circuitry is substantial, it may be called embedded test.  If BIT is implemented in software, it is called BIT software.

So we tentatively adopted these terms for the Committee, but as the Committee Chair, Dr. Steve Pateras of LogicVision was not in attendance that day as well as other key members, we thought we will rubber stamp them soon.  Ron Press of Mentor Graphics saw our “work” and showed us that his company’s glossary disagreed with some of our views, so we decided to send these few definitions out for the entire TMAG membership for consensus.  It didn’t take long before we received some valid objections.  Craig DePaul, President of DSI International felt that as a system-level DFT tool maker, the definitions we offered were too circuit oriented and were not inclusive enough of systems that may utilize non-electronic parts as well. 

But it was Dr. Kenneth Parker of Agilent Technologies, Inc. who demonstrated that we have a great deal more work to do.  He asked whether we can actually tackle such definitions before we have consensus on some more basic terms such as “Defect,” “Failure,” “Fault,” and yes even “Test.”   He wrote,  If you do not have clarity at this first level down, you will compromise the usefulness of any additional work.”  I agree.

The problem, in my opinion, stems from the evolution of the field.  We started with probing, moved on to scanning, compressing, while we tested for verification, for diagnoses, for repair, and for characterization.  We did this all in a hurry, always trying to catch up with the latest circuits that left previous methods obsolete.  There were terms we didn’t use long enough to define.  The definitions themselves changed.  A good example is Built-In Test (or is it Built-In Self Test, or is it Embedded Test?)  Today many circuits use BIST, neither for go/no-go test, nor for diagnoses, not even for prognoses.  They use BIST to achieve built-in self repair (BISR?).  So, even if the circuit is the same, how can we call a BISR a mere built-in tester?

If  we do not have a common language, we will not be able to communicate.  We need our definitions.  Ken Parker referred us to “Advances in Electronics Testing” (chapter 11) edited by Gizopoulos, Springer, 2005 and it does a nice job of defining some basic terms.  There are, of course, many other text with important definitions, but we need an industry-wide standard.  This is where you, members of the BestTest community can help.  We have an extensive Test Dictionary right here in the BestTest Knowledge Base with over 2,750 test terms. You can search definitions and you will find that it is always includes the source.  In many cases there are multiple definitions of the same term and that is quite all right.  By examining the source, you can make your decision of which one to use.

In keeping with the BestTest community approach, however, we need your input.  Searching for a definition is one thing, but being able to contribute your own definition is your civic duty to our community.  If you search for a definition in The BestTest Definitions and do not find it you will likely look elsewhere.  When you do find it, please come back and share it with the rest of us.  It takes less than 2 minutes to post a definition, just copy and paste.  Leave us the source (with a linked web site if you like) so we can give credit where credit is due.

In the meantime, can anyone define the term “Test?”  The BestTest Directory offers the following:

Test 

A procedure taken to determine under real or simulated condition the capabilities, limitations, characteristics, effectiveness, reliability or suitability of a material, device, system, or method.
Source: Adopted from MIL-STD-1309C by A.T.E. Solutions, Inc.
Sequence of operations intended to verify the correct operation or malfunctioning of a piece of equipment or system.
Source: Twisted Pair
Technical operation that consists of the determination of one or more characteristics of a given produce, process or service according to a specified procedure.
Source: ISO/IEC GUIDE 2, 1996 Paragraph 13.1
An activity in which a system or component is executed under specified conditions, the results are observed or recorded and an evaluation is made of some aspect of the system or component.
Source: The New IEEE Standard Dictionary of Electrical and Electronics Terms, IEEE Std. 100-1992
The observation of a known expected response as a result of the application of a known input vector into a circuit in a known state -- the purpose being to measure some effect against a compliance standard.
Source: Inovys 
 

Do you disagree with these definitions?  Please add your own.

Product/Service Focus

This issue's focus is Design for Test vs. Design for Testability.  Compare worldwide web results for Design for Test, Design for Testability and DFT Test.

 
What's New in Test
Announcements
  4/15/2008 Corelis ports development tool to latest AMCC processors
  4/14/2008 JTAG Technologies - more focus on Russia
  4/10/2008 Digitaltest and Fast Electronic Technology Ltd. Sign Agreement
  4/10/2008 KLA-Tencor broadcasts tender offer to acquire ICOS
  4/9/2008 Test Research Inc. wins "Best Supplier of 2007" Category of EM-Asia's Innovation Awards
  4/8/2008 Test vendors address WiMAX, LTE at CTIA show
  4/2/2008 Test Engineer of the Year award Goes to ???
  4/1/2008 Dell cuts jobs, closes desktop plant as it looks to save $3B
  4/1/2008 EPA suspends IBM from seeking new US federal gov business
  4/1/2008 iNEMI Launches New Collaborative Efforts - including Boundary Scan
  3/26/2008 Teradyne Users Group Conference Celebrates 25 Years
  3/26/2008 TVonics selects XJTAG for debug/test of digital TV recorders
  3/19/2008 Spansion Reduces Reliance on Manufacturing Services
  3/17/2008 Curtiss-Wright employs XJTAG system for PCB testing
Application Notes
  4/3/2008 Chop the noise gain to measure an op amp's real-time offset voltage
  4/3/2008 Compact laser-diode driver provides protection for precision-instrument use
  3/20/2008 Precision voltage-controlled current sink tests power supplies
Books
  3/20/2008 Digital Communications Test and Measurement: High-Speed Physical Layer Characterization
Case Studies
  3/27/2008 Stencil, Solder Paste & Printing Defects - Solder Paste Shorts
Magazine Articles
  4/16/2008 Understand 3G LTE testing challenges
  4/3/2008 Within a whisker of failure - Tin whisker causes problems
  4/1/2008 A maturing AOI industry moves forward
  4/1/2008 Adopting a Lean Approach to Quality Management
  4/1/2008 Expanding the Use of Synthetic Instruments
  4/1/2008 Improving Yield With Retooling and Robust Infrastructure
  4/1/2008 MIMO challenges existing ATE
  4/1/2008 PC Based Logic Analyzers - Small Instruments With Big Performance
  4/1/2008 The Continuing Evolution of MIL-STD-461: Version F
  3/20/2008 External instruments here to stay
  3/20/2008 Using IC prototyping to optimize design implementation
  3/19/2008 Agilent's x-ray systems take a new direction: Part 2
  3/18/2008 Design for Low-Power Manufacturing Test
Product Releases
  4/16/2008 First reconfigurable avionics test system platform debuts
  4/16/2008 USB DMM has 6½ digits
  4/11/2008 Channel emulator line tailored for 4G wireless
  4/11/2008 Pickering Interfaces introduces new fault insertion modules for HILS Automotive Test
  4/9/2008 Arbitrary Waveform Generators (AWGs) ease communication equipment testing
  4/7/2008 Seiko NPC Sees a Big Productivity Boost in DFT Design Flow With Integrated Cadence Test and Synthesis Technologies
  4/3/2008 New antenna coupler eases TETRA radio testing
  4/2/2008 Agilent Technologies unveils AOI platform fully qualified for all SMT line inspection
  4/2/2008 Dage introduce XD7500NT digital x-ray inspection system to North America
  4/2/2008 GOEPEL introduces IEEE-Std. 1149.6 compliant JTAG/Boundary Scan I/O module
  4/2/2008 Measurement receiver supports all wireless techs in all RF bands
  4/1/2008 ASSET® is first to support Intel®’s new Atom™ processor with CPU emulation test and diagnostics
  4/1/2008 Innovative flying probe test, soldering solution debut
  3/31/2008 CheckSum Launches Unique On-board Gang Programmer for Programming Multiple Parts Simultaneously
  3/27/2008 New AOI for Microelectronics from LANDREX
  3/27/2008 Safeguarding offshore EMS soldering quality - G3 SPA 1000 "all-in-one" 6-test solder paste analyser
  3/26/2008 Goepel Releases SFX-6308 Boundary Scan Module
  3/26/2008 Hot swap your PCI Express boards
  3/26/2008 Pickering Interfaces Introduces Two New LXI Switching Solutions
  3/25/2008 Hybrid tech removes physical test points for ICT
  3/24/2008 Mini USB power meter touts wide frequency range
  3/20/2008 New Cover-Extend Technology Eliminates Need for Physical Test Points for In-Circuit Test
  3/20/2008 Tektronix unveils fastest scope probe yet
  3/20/2008 Teradyne introduces UltraWave 12-GHz instrument
  3/19/2008 Test solution rolls for DDR2, DDR3 SDRAM
  3/18/2008 Digital instrument meets need for deeper pattern memory
  3/18/2008 Test platform fully supports W-CMDA A-GPS conformance testing
  3/17/2008 New RF Switch PlatformCan Reduce Custom-Switch Development Time by Half
Reports
  4/16/2008 High-Tech Industry Added 91,400 Jobs in 2007 - Fewer than in 2006
  4/1/2008 Salary Survey
  3/27/2008 IPC Releases PCB Industry Results for February 2008
Video and Images
  4/7/2008 Video Interview: Rick Hartley and Kelly Dack Discuss Design For Profitability, or DFP
Web postings
  4/14/2008 Latest Apple laptops give users graphics glitches galore
  4/9/2008 Test PCs spread viruses
  3/26/2008 Metrology personnel shortage is real
 
Next Issue's Product/Service Focus
In our next issue of Product/Service Focus we will cover Testability and Built-In Test Products/Servic. You can add or upgrade a listing before the next issue comes out.

If you would like to include an exclusive article on how to best select Testability and Built-In Test Products/Servic, please contact LouisUngar@ieee.org.
 

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Events/Announcements
Upcoming
4/24
   Cost Effective Test Strategies Using ATE, DFT and BIST
4/30 - 5/1
   NEPCON East
4/30 - 5/1
   IEEE International Workshop on Silicon Debug and Diagnosis
5/4 - 5/8
   IEEE VLSI Test Symposium
5/5 - 5/8
   Design for Testability and for Built-In Self Test Course
5/11 - 5/16
   PCB East 2008
5/12 - 5/15
   International Instrumentation and Measurment Technology Conference (I2MTC)
5/12 - 5/15
   Random Vibration, Shock Testing, HALT, ESS, HASS Measurements, Analysis and Calibration
5/12 - 5/15
   International Instrumentation & Measurement Technology Conference
5/19 - 5/23
   Asia-Pacific Symposium on Electromagnetic Compatibility
5/25 - 5/29
   IEEE European Test Symposium (ETS'08)
6/3 - 6/6
   NEPCON / MICROELECTRONICS Penang
6/16
   Cost Effective Test Strategies Using ATE, DFT and BIST
6/18 - 6/20
   International Mixed-Signals, Sensors, and Systems Testing Workshop (IMS3TW'08)
7/15 - 7/18
   Random Vibration, Shock Testing, HALT, ESS, HASS Measurements, Analysis and Calibration
7/28 - 7/30
   Design for Testability and for Built-In Self Test Course
8/5 - 8/7
   National Instruments NIWeek 2008
9/22 - 9/24
   Instrumentation and Methods for Electrical and Electronic
11/25 - 11/26
   Nordic Test Forum's TestForum 2008
New Definitions
New terms added to the Test Definition section:
At Speed Test
Automatic Test Pattern Generation
Build-in Self Analysis
Built-In Self Repair
Compaction
Design For Manufacturing
Design Rules Checking
Embedded Compression
Embedded Deterministic Test
Gate Oxide Breakdown