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An A.T.E. Solutions, Inc. Internet Publication
Volume 8 Number 3 February 1, 2004
 
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What's New in Test
Announcement
  1/30/2004 ASC International takes on sales and service of Samsung AOI Equipment
  1/30/2004 Motorola selects Mentor TestKompress, Calibre offerings
  1/27/2004 Agilent expects to exceed guidance for Q1 results
  1/22/2004 Intersil and ChipPAC deploy Teradyne's FLEX Test System
  1/22/2004 SynTest Establishes Operations in China and Appoints Hyperform as Distributor
  1/22/2004 Viking announces sales in UK and South Africa
  1/21/2004 PowerDNA® voted one of the best Test Products of the Year by Test & Measurement World Magazine
  1/20/2004 Measurement Computing Corporation acquires LABTECH
  1/18/2004 Amkor certified 'Green Partner' by Sony
  1/16/2004 Advantest America Promotes from Within
  1/16/2004 Nanometrics Supplies Ebara with CMP Metrology
  1/16/2004 US Air Force uses pinPoint testers from DiagnoSYS to save $13 million
CD,DVD,Tape
  1/22/2004 Agilent offers logic analyzer web-based video demos
Magazine Article
  1/22/2004 Common-mode analysis of skew
  1/16/2004 Fingerprint sensors score in handsets
  1/16/2004 Tackling test for next-gen WLAN RF ICs
Presentation and Web Seminar Archives
  1/28/2004 IP Quality & Verification: the User View vs the Vendor View
  1/28/2004 Oscilloscope Basics
  1/22/2004 Signal Integrity Series: Analyzing Digital Jitter and its Components
  1/21/2004 Pulsed VNA Measurements: The Need to Null!
  1/20/2004 Combining Simulation and Test to Shorten RF Systems Design Development Cycles
  1/20/2004 EGPRS Test: Meeting the challenge of 8PSK measurements
Press Release
  1/29/2004 Tel-Instrument Electronics Releases FLEXIBUS Family of Databus Analyzers
  1/21/2004 PXI 100 Controller for ScanWorks Boundary Scan
  1/17/2004 TI raises stakes with 14bit ADC
Report
  1/26/2004 Silicon Valley still losing jobs, report says
  1/20/2004 Global Equipment, Chip Bookings Grew in December
  1/20/2004 S&P: Semi Stocks Could See 25% Growth
 
Are Smart Power Supplies Nourishing Food for Thought About Functional Testing?

Test Engineers may be finding it more and more difficult to keep up with the growing and changing demands created by the never ending craze for “High(er) Tech” power supplies.  I suspect that to the volume manufacturers of power supplies, the battle seems unending.  There is, of course, the always-present demand for greater IC integration, involving higher component and power density. 

Notwithstanding these expected and ongoing developments with product design and performance requirements, there’s a fairly new “trick” available for helping engineers to better accomplish these goals.  The “trick” is to make power supplies that “talk” as well as “listen”.  Communication “enhancements” enable the power supply to assume more responsibility for monitoring and governing its own “health”.

As Applications Engineering Manager for Autotest Company, I see a lot of new stuff – and over the years have witnessed the migration of many new technologies into the world of power supplies.  Our Functional ATE systems have always required specialized Unit Under Test (UUT) communications. These needs have been addressed with a variety of solutions involving protocols, busses, and advanced levels of component integration and complexity.  For some high tech Department of Defense (DOD) products, we employed what have become now proven and accepted solutions such as RS232, RS 485, IEEE 802.3 Ethernet, IEEE 488, MIL 1553, I2C, and many others.  These technologies can simply read a serial number from a register or actually direct the Power Supply through a complete routine of calibration and internal verification.  In such cases, the ATE’s hardware or equipment responsibilities may be simple, but the communication process, coordination and test sequencing can be quite complex. 

Along with the continuing trend for making the power supplies more technologically capable, powerful, versatile and complex there’s a rapidly expanding area of expansion in the field of self-diagnostics and maintenance.   We are also seeing more and more the use of processors in power supplies … to make them more versatile and flexible for diverse applications.  A typical application is with power supplies that are employed as sub-systems of a more complex DOD product.  These power supplies are often asked to provide much more than just delivering system power.  They are often integrated and designed to monitor, react and respond to variable and changing requirements of a much more complex system.

At Autotest, we first addressed these more complex phenomena with the introduction of our UPS ATE.  The Uninterruptible Power Supply (UPS), by design, has a responsibility to communicate with the computer to which it is delivering backup power.  UPS manufacturers, taking advantage of the need for UPSs to have communication and processing ability decided to let the processor do other things as well, like calibrate output parameters and provide functional controls for supporting them.   Built In Test (BIT) functionality is becoming more common with power supplies, making them capable of being programmed to sequence through an internally controlled test process and to report the results.  With the integration of a processor and a bi-directional, software-controlled communication bus to manage this process, significant additional diagnostics and information can be provided.

The latest communication trend in communications for commercial power supplies is in the application of the IIC Bus (Inter-Integrated Circuit), or I2C as it has come to be called.  The I2C Bus is an essentially a two-wire, low to medium speed, communication bus developed by Philips Semiconductors in the early 1980s.  It was created to provide a low-cost chip-to-chip communication links for such things as volume and contrast controls in radios and televisions. Over the past two decades, the I2C has expanded its communications role to include power supplies.

So how do Power Supply ATE manufacturers, such as Autotest, address the changing needs of the Test Engineer? Communication has always been an integral part of Autotest’s ATEs.  We use IEEE 488 extensively to control instrumentation, making communication integral with all our systems.  Our open-ended software and language simplifies development of Windows supported communication as an inherent function of test programs for the UUT.  Perhaps our greatest challenge has been in developing the language library to simplify the process of building flexible and comprehensive routines into tests.  The I2C posed a challenge in that regard.  A commercially available PC bus controller, however, provided a simple solution for adapting the I2C to developing hardware and software integration for controlling communication as a part of testing the power supply.  Our APG for Windows™ software, implementing and integrating new protocols and busses, has provided test engineers with an automated test programming and system control environment tailored to the needs of most any Power Supply.  It allows a Test Engineer to design simple solutions for complex routines for engaging a power supply to whatever type of interaction may be required.

In essence, the marriage between power supplies and functional testing is a longstanding and always developing relationship.  To coin a proven metaphor, “the key to any good marriage is communication.” 


Jim Pennington, Applications Engineering Manager- AUTOTEST Company
 
Product/Service Focus
This issue's focus is Automatic Test Equipment/Power Supplies and Sources. You can view or add to our existing list of these Products.
 
Next Issue's Product/Service Focus
In our next issue of Product/Service Focus we will cover Test Fixtures and Probes. You can add or upgrade an inspection equipment before the next issue comes out.

If you would like to include an exclusive article on how to best select Measuring Equipment, please contact LouisUngar@ieee.org.
 

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Events/Announcements
This month:
2/2 - 2/5
   DesignCon 2004
2/10 - 2/13
   EXPO COMM 2004
2/10 - 2/12
   EMV 2004 - International Exhibition and Conference on Electromagnetic Compatibility (EMC)
2/10 - 2/12
   Pan Pacific Microelectronics Symposium
2/12 - 2/15
   Componex ElectronicIndia
2/16 - 2/20
   Design, Automation and Test in Europe (DATE) 2004
2/18 - 2/20
   Semicon Korea 2004
2/22 - 2/26
   Optical Fiber Communications Conference
2/22 - 2/26
   APEC 2004 - Applied Power Electronics Conference
2/24 - 2/25
   Software Radio 2004
2/24 - 2/26
   IPC SMEMA Council's APEX
3/1 - 3/2
   Embedded Systems Conferences-China
3/1 - 3/2
   The Electronic Design Automation & Test Expo
3/3 - 3/4
   The Electronic Design Automation & Test Expo
3/4 - 3/5
   Embedded Systems Conferences-China
3/7 - 3/10
   Burn-in and Test Socket Workshop
3/7 - 3/11
   Nanotech 2004
3/8 - 3/9
   Embedded Systems Conferences-China
3/8 - 3/10
   Wireless Systems Design Conference & Expo
3/8 - 3/10
   Latin-American Test Workshop
3/8 - 3/11
   SAE 2004 World Congress
3/16 - 3/17
   PCB Design Conference West
3/17 - 3/19
   electronicaChina 2004 & ProductronicaChina 2004
3/24 - 3/25
   Northcon 2004
3/27 - 3/28
   Test and Analysis of Component-based Systems: TACoS'04
3/28 - 3/30
   IMAPS ATW on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications
3/29 - 4/2
   electronica USA and Embedded Systems Conference
3/30 - 4/2
   Test Expo
3/30 - 4/1
   Aerospace Testing Expo 2004
4/4 - 4/7
   International Test Synthesis Workshop ITSW 2004
4/5 - 4/7
   DesignCon East 2004
4/18 - 4/21
   Design and Diagnostics of Electronic Circuits and Systems Workshop
4/25 - 4/28
   Institute of Environmental Sciences and Technology ESTECH 2004
4/25 - 4/29
   IEEE VLSI Test Symposium
4/26 - 4/28
   MicroElectroMechanical Systems MEMS IV
4/27 - 4/28
   IMAPS Ceramics Conference
New Definitions
New terms added to the Test Definition section:
Dynamic Linearity
In-system Programmable Generic Digital Crosspoing Devices
Inter-Integrated Circuit
Response Time
Smart Antenna System
Synthetic Instruments
We now have 1616 test terms in our Test Definition section.

Share your definitions with the test community.
 
Test Vendors
We now have 3443 test vendors listed in the Test Vendor Directory. Check for accuracy.
 
The following companies have recently placed advertising with us:
Vendors:
A.T.E. Solutions, Inc.
AESOPS Inc.
BDQ
Elanix
IEST (Institute of Environmental Sciences and Tech
MPI Melting Pressure
Qualtech Systems, Inc.
Tiepie Engineering
WesTest Engineering Corp.
Products/Services:
A.T.E. Solutions, Inc.
   Consulting Services
   Consulting, Training and Books
   The Testability Director
GOEPEL electronic GmbH
   SCANPLUS Board Grabber
Interpoint Corp.
   LCM120
Testpro AS
   TP2101 Testsystem
UltraTest International
   MultiTrace
WesTest Engineering
   WT2000
 
Links Worth a Click
Test sites of interest:




AutoTestCon
Cable Test Systems, Inc.
Chroma USA
Evaluation Engineering
International Test Conference
IPC - APEX Conference Organizers
Powell-Mucha Consulting, Inc.
Test & Measurement World

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