The Newsletter

An A.T.E. Solutions, Inc. Internet Publication
Volume 8 Number 6 March 16, 2004
 
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3/23/2004, 9:00 AM - 4:00 PM Tutorial T5 - Design for Testability

3/24/2004, 9:00 AM - Noon Tutorial T6 - Embedded and Built-In Self Test

3/24/2004, 2:00 PM - 5:00 PM Tutorial T3 - Automatic Testing Strategies for Today's Complex Circuits


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 This Issue's Feature Article 

The importance of the correct choice in Bare Board ATEs

Gianotti Nicoletta, Seica SpA, ITALY

What's New in Test
Announcement
  3/15/2004 Agilent Goes After Used Instrument Market
  3/15/2004 Teradyne establishes university scholarship program in China
  3/12/2004 Xilinx purchases multiple Teradyne FLEX Systems
  3/9/2004 IPC announces attendance figures for co-located APEX exhibition and conference
  3/4/2004 Agilent revamps logic analyzer line
  3/4/2004 Agilent Technologies' tool speeds design of autonomous motorcycle
  3/4/2004 Fudan University opts for Teradyne design verification tool
  3/1/2004 Christopher Grachanen selected Test & Measurement World's Test Engineer of the Year
  3/1/2004 LogicVision Names George Swan VP of Engineering
Company Newsletter
  3/4/2004 PCB Pulse - Global Perspectives on Test and Inspection
Magazine Article
  3/4/2004 U.S. ATE Export Rules to be Eased
  3/1/2004 Applying Advanced Fault Models
  3/1/2004 Atomic Force Microscopes (AFMs) pinpoint surface defects
  3/1/2004 Getting On-Board ATE Test Fixtures
  3/1/2004 How to automate stress tests in silicon devices
  3/1/2004 How to Get Accurate Tap Density Measurements Using Charge Pumping
  3/1/2004 It’s All in the Noise
  3/1/2004 Less costly HW-assisted verification needed
  3/1/2004 Metrology must advance to support 45nm
  3/1/2004 Protocol analyzers restore network health
Presentation and Web Seminar Archives
  3/9/2004 Portable Cable-Sweeping and Spectrum Analysis for Defense/Aerospace Applications
  3/4/2004 LabVIEW for Control Design and Validation -- Archived Web Event
  3/2/2004 Memory Testing Techniques
  3/2/2004 Testing and Evaluating High Resolution ADCs
Press Release
  3/9/2004 Agilent Technologies Inc. has introduced Agilent Visual Engineering Environment (VEE) Pro 7.0
  3/8/2004 Berkeley Nucleonics’ Firmware Upgrade Accelerates the Processing Speed of the Model 555 Digital Delay Generator Up to 10 Times Faster
  3/8/2004 Xidat 6600 x-ray service announced
  3/4/2004 1 to300 MHz Dual Frequency Synthesizer on PCI Board for Tones, Sweeps, Phase Shifts and Modulations
  3/3/2004 Agilent introduces connectorless logic analyzer probes
  3/3/2004 Agilent introduces modular logic analyzer
Report
  3/10/2004 Electronic Business ONLINE REPORT: Electronics Sales Growth Back on Track
  3/10/2004 Intel Says No to China's WAPI
  3/1/2004 ATE Is Fastest Growing Segment of Semi Equipment Industry
  3/1/2004 February Manufacturing ISM Report On Business
Standard
  3/8/2004 IPC Releases IPC-7351 library generation tools
  3/3/2004 Cannon Begins NIST Alliance
 
The importance of the correct choice in Bare Board ATEs
The continuous technological evolution of electronic components dictates ever-higher performance together with ever-smaller geography. This has significantly changed test strategies of populated electronic boards as well as printed circuit boards. Up to a few years ago the latter (PCBs) constituted only a minimum part of the technological "know-how" of the completed board, acting simply as a base support and interconnect medium for the electronic components, characterized by a relatively low cost and simplicity, which was easy to test for continuity and isolation on a bed of nails type fixture connected to a tester.

Today's scenario is completely different: it is very common to find multilayer printed circuit boards (PCBs) with thousands of pads, some maybe a few tenths of a millimeter wide, on both sides, along with embedded components. In this case it becomes extremely difficult, if not impossible, to build a fixture, especially in terms of cost and time required to build it. If you also consider the accelerated life cycle of today's electronic products (and therefore also their relative PCB) and the rapidity with which they are modified to satisfy evolving market trends, it is evident that it is becoming more and more difficult to justify the costs of a traditional "bed of nails" type test, especially in lower volume production runs.

This is why "flying probe" test systems have become an important part of most PCB manufacturing strategies. There are several things to keep in mind when evaluating the purchase of a flying probe tester.  For example, it should be able to probe both sides of the PCB simultaneously with at least four probes (two per side) and there should be a camera on each side for centering on fiducials of the bottom and top layers independently.

The test probes should have some degree of angle with respect to the board surface to facilitate contact on drilled pads, and it should be possible to program the pressure applied by each test probe on each test point, in order to adapt the test to different situations; for example to guarantee a stable contact when testing "no clean process" PCBs or to minimize impact on the pads of the printed circuit. The system should also be able to utilize controlled loop feedback on the Z axes to "learn" various points on the PCB in order to then compensate for warping, bowing, etc.

Another important factor in the "cost of ownership" of a flying probe tester is the setup time required for each new part number; program generation should be completely automatic, so it is essential that the software be able to import the CAD data (Gerber files) of the PCB using the most common standards, including the widely used IPC356 standard (version A or B). The tester software should be intuitive and easy to use, and should include the capability to execute parametric tests of components such as resistors, capacitors, p-n junctions, which are embedded in a growing number of PCBs.

Loading the PCB into the system should be fast and easy for the operator; on the basis of the volumes of PCBs to test, it may make sense to choose a system which can be connected to a magazine or automatic loader for faster (and autonomous) load and unload. The availability of a vacuum-type board support is a plus when testing flex circuits, inner layers or very thin PCBs.

After test, a software repair station is a useful tool that helps the operator to locate the position of the failing net on the board on the basis of the test results by displaying, for example, the most probable points for a fault to occur on the net. The repair station can be used as stand-alone software or in network configuration to exchange statistics data on the test.

Software tools, which enable a “distributed” test strategy, are also important in the context of the growing complexity of PCBs. These tools enable the user to “split” the test with respect to the system used to verify the various parts of the circuits; for example the flying probe tester could be used to test fine pitch or BGA areas, while the rest of the PCB could tested on a universal tester to maximize test coverage as well as throughput.
Gianotti Nicoletta, Seica SpA, ITALY
 
Product/Service Focus
This issue's focus is Automatic Test Equipment/Bare Board Testers. You can view or add to our existing list of these Products.
 
Next Issue's Product/Service Focus
In our next issue of Product/Service Focus we will cover Calibration Equipment. You can add or upgrade an inspection equipment before the next issue comes out.

If you would like to include an exclusive article on how to best select Calibration Equipment, please contact LouisUngar@ieee.org.
 

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Events/Announcements
This month:
3/17 - 3/19
   electronicaChina 2004 & ProductronicaChina 2004
3/22 - 3/25
   International Conference on Microelectronic Test Structures
3/24 - 3/25
   Northcon 2004
3/25
   Design Prediction & Early Verification of OFDM Reference Radio
3/27 - 3/28
   Test and Analysis of Component-based Systems: TACoS'04
3/28 - 3/30
   IMAPS ATW on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications
3/28 - 3/31
   Applied Physics Society of Japan Meeting (JSAP)
3/29 - 4/2
   electronica USA and Embedded Systems Conference
3/30 - 4/2
   Test Expo
3/30 - 4/1
   Aerospace Testing Expo 2004
4/4 - 4/7
   International Test Synthesis Workshop ITSW 2004
4/5 - 4/7
   DesignCon East 2004
4/18 - 4/21
   Design and Diagnostics of Electronic Circuits and Systems Workshop
4/18 - 4/21
   International Symposium on Physical Design (ISPD)
4/25 - 4/28
   Institute of Environmental Sciences and Technology ESTECH 2004
4/25 - 4/29
   IEEE VLSI Test Symposium
4/26 - 4/28
   MicroElectroMechanical Systems MEMS IV
4/27 - 4/28
   IMAPS Ceramics Conference
5/4 - 5/6
   Nepcon East Electro
5/4 - 5/6
   NEPCON East/Electro 2004
5/13 - 5/15
   Automation, Quality & Testing, Robotics (AQTR 2004)
New Definitions
New terms added to the Test Definition section:
Root-mean-square (RMS)
Sense Leads
Stimulus Leads
We now have 1627 test terms in our Test Definition section.

Share your definitions with the test community.
 
Test Vendors
We now have 3492 test vendors listed in the Test Vendor Directory. Check for accuracy.
 
The following companies have recently placed advertising with us:
Vendors:
A.T.E. Solutions, Inc.
AESOPS Inc.
BDQ
Elanix
Furaxa Inc.
IEST (Institute of Environmental Sciences and Tech
MPI Melting Pressure
Qualtech Systems, Inc.
Tiepie Engineering
WesTest Engineering Corp.
Products/Services:
A.T.E. Solutions, Inc.
   Consulting Services
   Consulting, Training and Books
   The Testability Director
GOEPEL electronic GmbH
   SCANPLUS Board Grabber
Interpoint Corp.
   LCM120
Testpro AS
   TP2101 Testsystem
UltraTest International
   MultiTrace
WesTest Engineering
   WT2000
 
Links Worth a Click
Test sites of interest:




AutoTestCon
Cable Test Systems, Inc.
Chroma USA
Evaluation Engineering
International Test Conference
IPC - APEX Conference Organizers
Powell-Mucha Consulting, Inc.
Test & Measurement World

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