Ball Grid Array Inspection and Defect Guide

This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for use in a company standard and may be edited to suit the company documentation system. Examples of satisfactory standards are provided with a complete guide to possible process defects. The defect section may be viewed with small examples to make searching easy and then each sample may be viewed at both half and full screen. A description of each of the defects is included with the examples. A full animation of the surface mount assembly process is included on the disk which includes the BGA, double sided assembly and through hole/Intrusive reflow assembly. This section features a commentary by Bob Willis or can be viewed with just a text guide. The CD ROM also includes over 130 picture files which may be used freely in training material and standards in a manufacturing company provided that the resulting material is not resold.