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Analog Test and Fault Isolation |
The problems that you will encounter when you try to test analog circuits with an ATE. The course will show how accuracies and resolutions can affect your test results. You will also learn to deal with analog simulation and fault simulation issues. The IEEE-1149.4 Mixed Signal Testability as well as the IEEE-1149.6 mechanisms will also be explored.
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ATE Selection, Design and Programming |
This course covers every aspect of a test engineer's responsibility. Participants will learn how to select an automatic test equipment (ATE) from the number of choices and generically different types available. You will learn how to build an ATE from instrumentation and other building blocks. You will learn the bussing requirements of the IEEE 488, VXIbus, and PC-based instruments. You will also learn the software issues. The course will teach you how to approach a functional test programming activity for digital circuits. (In the longer, three-day course, analog test programming is also covered.) Finally, you will learn test management issues, such as test program development estimation, acquisition and quality assurance.
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ATLAS |
This course will teach you how to write test procedures and code for many of the ATEs used in the military and airline industries using the Abbreviated Test Language for All Systems (ATLAS) a standard that is maintained by the IEEE.
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Ball Grid Array Inspection and Defect Guide |
This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for use in a company standard and may be edited to suit the company documentation system. Examples of satisfactory standards are provided with a complete guide to possible process defects. The defect section may be viewed with small examples to make searching easy and then each sample may be viewed at both half and full screen. A description of each of the defects is included with the examples. A full animation of the surface mount assembly process is included on the disk which includes the BGA, double sided assembly and through hole/Intrusive reflow assembly. This section features a commentary by Bob Willis or can be viewed with just a text guide. The CD ROM also includes over 130 picture files which may be used freely in training material and standards in a manufacturing company provided that the resulting material is not resold.
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Cost Effective Tests Using ATE, DFT and BIST |
The two main reasons to test are 1) to eliminate failures escaping to your customers and 2) to reduce the life cycle cost of a product by eliminating penalty costs associated with delivering potentially faulty units. Many people have traded one of these requirements for the other, but with the advent of more sophisticated automatic test equipment (ATE), more attention paid to design for testability (DFT) and utilizing built-in self test (BIST), it is possible to do both. This tutorial provides a thorough understanding of each of these tools and strategies for more comprehensive and cost-effective testing. The course will combine the technical aspects of testing today’s complex circuits with the economics demanded by lower costs, faster times to market and a higher rate of obsolescence for both electronic products and test equipment.
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