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Online Catalog of Educational Courses and Resources
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What You Will Learn
Accelerated Reliability Engineering: HALT and HASS
Accelerated reliability engineering is becoming a popular industry alternative to on-going product quality testing. Highly Accelerated Life Tests (HALT) and Highly Accelerated Stress Screens (HASS) are intensive methods, which use stresses higher than the field environments to expose and then improve design and process weaknesses. HALT and HASS offer faster, cheaper and more accurate results than traditional reliability testing techniques. This book provides comprehensive coverage of the methods and philosophy behind this successful approach. Production managers will appreciate the time-saving and cost-effective testing techniques described. Design engineers involved in quality assurance and students of reliability engineering will benefit from this unique resource detailing the technical aspects of accelerated reliability engineering. Features Include: · Coverage of the physics of failure and useful testing equipment enabling those new to the area to grasp the concepts behind HALT and HASS · Overview of the HALT technique demonstrating how to find design and process defects quickly using accelerated stress methodology during the design phase of the project · Examination of detection screens and modulated excitation used to detect flaws exposed in HALT · Description of how to set up a HASS profile and how to minimize costs whilst retaining efficiency · Applications of HALT and HASS and analysis of common mistakes highlighting the pitfalls to avoid when implementing the methods
Accelerated Stress Testing Handbook: Guide for Achieving Quality Products
Electrical Engineering Accelerated Stress Testing Handbook Guide for Achieving Quality Products As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST). The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame. Important topics covered include: * Theoretical basis for AST * General AST best practices * AST design and manufacturing processes * AST equipment and techniques * AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.
Building your own ATE
You will learn how to put together an Automatic Test Equipment (ATE) from instrumentation built to the IEEE-488 (GPIB or HPIB) and VXIbus and PXI standards.
Burn-In: An Engineering Approach to the Design and Analysis of Burn-In Procedures
Introduces the benefits and techniques of performing burn-in on components, sub-assemblies, and complete systems. An engineering approach, this text emphasizes practical applications of reliability theory. Presents numerous real-life examples. Provides the fundamental information needed to design and analyze a meaningful and effective burn-in procedure.
Cabling Handbook, The , 2nd Edition
The #1 A-Z network and telecom cabling reference—100% updated! New coverage! Fiber, home networking, cable modems, and much more WAN connections, xDSL wiring-even wireless networks Step-by-step planning, implementation, and management Systematic troubleshooting guide Quick-reference, task-oriented format! The professional's guide to computer and telecom cabling! Completely updated! Fiber, home networking, cable modems, wireless, and more Choosing the right vendors and products Great preparation for Network+ cable-related exam objectives! The Cabling Handbook, Second Edition is a thorough, up-to-the-minute professional's guide to every aspect of LAN and telecommunications cabling, from planning through installation and management. From Category 5 twisted pair and fiber to the latest wireless LAN solutions, it's all here: standards, product comparisons, topology and architecture design, electrical and safety considerations, and more—including invaluable information for anyone preparing for CompTIA Network+ certification. This brand new second edition has been updated with extensive new coverage of fiber technologies, home networking, cable modems, and much more. Rely on this book for expert guidance on: Estimating the cost of cable plant upgrades Choosing the right installer and supervising installation Selecting the optimal cabling system and products Deploying wireless LANs with maximum reliability, coverage, throughput, and security Managing cable systems to minimize long-term costs and maximize long-term reliability Troubleshooting cable system problems rapidly and effectively Expert John Vacca goes beyond LANs, reviewing key cable-related issues associated with campus networks, WANs, and the Internet. You'll find extensive coverage of cable management software and documenting cable systems. The book contains detailed listings of top cable installers, fiber optic cable manufacturers, cable labeling vendors, SCSI, and wireless LAN providers. Whether you buy, sell, or manage cabling systems, you need to maximize quality and minimize disruption—now and for decades to come. One book shows you how: The Cabling Handbook, Second Edition.
Contaminants and Moisture Can Disrupt Your Electronics
Course description This course provides details about the root causes of many poorly understood electronic failures. The chemistry encountered in many end-use environments will be covered at length. We will discuss sources of contamination and the adverse effects of contamination on high-rel electronic systems. This understanding will enable participants to create more complete and accurate testing protocols for evaluating the true long-term reliability of new electronic designs, materials and processes. This understanding will also help organizations to troubleshoot production and field problems with existing electronic designs, materials and processes. Illustrated lectures and classroom discussion reveal the dangerous yet little recognized synergistic (that is, combined) field conditions of contamination + moisture, especially when field thermal and vibration stresses are added. These conditions will cause the premature failure of many forms of allegedly strong and highly reliable (but actually weak and unreliable - vulnerable) electronic equipment. Current production testing and screening protocols (as well as reliability studies) largely ignore these dangerous combined environments. Ever-smaller feature sizes and separations, plus smaller signal levels and higher frequencies all act to increase vulnerability to contaminants and moisture. Without proper testing, too much blind trust is being placed in supposedly safe conformal coatings and other protective measures. Subtle changes in test protocols, which can cause major differences in the results, will be discussed, along with some of the limitations of present measuring and monitoring equipment. A major topic: the optimum point in the production cycle at which to screen. Objectives High reliability electronic systems utilizing new designs and expanded systems integration are required to meet performance based specifications. Contracts should include some form of laboratory validation method prior to (1) awarding the contract, (2) making milestone payments, and (3) assessing penalty clauses if fielded equipment fails to perform fully. Upon completion of this course, participants will realize the potential cost savings of highly accelerated life testing (HALT) that combines contamination with traditional testing protocols. The course will enable participants to generate more realistic test data needed for (1) predicting long term reliability and for (2) predicting warranty/infant mortality. June 16-18, 2003 in Santa Barbara
Design for Excellence
This course will teach you how to design a product that is manufacturable, testable, reliable, useable, electromagnetically compatible, maintainable and supportable. In short, an electronic product that not only functions but is made to be of excellent value to you and to your customer.
Design-For-Test For Digital IC's and Embedded Core Systems
The first practical DFT guide from an industry insider. Skip the high-brow theories and mathematical formulas—get down to the business of digital design and testing as it's done in the real world. Learn practical testing strategies that address today's business needs for quality, reliability, and cost control, working within the tight deadlines of typical high-pressure production environments. Design-for-Test for Digital IC's and Embedded Core Systems helps you optimize the engineering trade-offs between such resources as silicon area, operating frequency, and power consumption, while balancing the corporate concerns of cost-of-test, time-to-market, and time-to-volume. You'll also boost your efficiency with the special focus on automatic test pattern generation (ATPG). The book includes a roadmap that allows you to fine-tune your learning if you want to skip directly to a specific subject. Key topics include: Core-based design, focusing on embedded cores and embedded memories System-on-a-chip and ultra-large scale integrated design issues AC scan, at-speed scan, and embedded DFT Built-in self-test, including memory BIST, logic BIST, and scan BIST Virtual test sockets and testing in isolation Design for reuse, including reuse vectors and cores Test issues being addressed by VSIA and the IEEE P1500 Standard Design-for-Test for Digital IC's and Embedded Core Systems is filled with full-page graphics taken directly from the author's teaching materials. Every section is illustrated with flow-charts, engineering diagrams, and conceptual summaries to make learning and reference fast and easy. This book is a must for the engineers and managers involved in design and testing. The enclosed CD-ROM contains full-color versions of all the book's illustrations in Acrobat PDF format. These images may be viewed interactively on screen or printed out to create overheads for teaching. Acrobat Reader software for Windows and UNIX computers is included.
Electronic Failure Analysis Handbook
Still digging for the latest developments and techniques in electronic failure analysis? The leading-edge methods for slashing product failure rates are all right here in this complete, comprehensive source. You'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance. Absolutely essential to anyone concerned with electronic product development and testing, the Handbook gives you ready-to-use, insider information on state-of-the-art EFA techniques; the how's and why's of electronic failures; failure prediction; warranty cost control; liability-costs and other issues.
Electronic Testing and Fault Diagnosis, 3rd Edition
Electronic Testing and Fault Diagnosis is a highly practical guide to the theory and methods of testing electronic circuits and systems. The third edition has been fully revised to provide up-to-date coverage of standard test procedures and reliability and maintainability analysis for most analog and digital electronic circuits and components. An introduction to automatic test equipment (ATE) is included, as well as data on passive and active components.
Environmental and Reliabilty Testing
This course covers the environmental and reliability tests performed during design and in manufacturing. You will learn about reliability prediction techniques and factors. You will learn what you can expect from reliability growth testing environmental stress screening (ESS). You will know how environmental stress screening (ESS) is used to flush out flaws introduced during processing, fabrication and assembly. When highly accelerated for longer duration, this is called Reliability Test. You will learn how Reliability Test can flush out design flaws resulting from incompatible interfaces, from erroneous functional performance in different environments and from weak components. By the completion of this course you will be able to formulate environmental and reliability test strategies for your own products.
Exploring the World of SCSI
So many peripherals, so little time! With Exploring the World of SCSI, you will gain the knowledge needed to get the most out of your peripheral devices, including scanners, printers, external disc drives and more. Focusing on the needs of the hobbyist, PC enthusiast, as well as system administrator, This is a comprehensive book for anyone interested in learning the hands-on aspects of SCSI. It includes how to work with the Logical Unit Numbers (LUNs) within SCSI, how termination works, bus mastering, caching, and how the different levels of RAID provide varying levels of performance and reliability. This book offers the functionality that intermediate and advanced system users need for configuring SCSI on their systems, while also providing the experienced professional with the necessary diagrams, descriptions, information sources, and guidance on how to implement SCSI-based solutions. Exploring the World of SCSI contains both real-world applications and theoretical information for the technical professional who wants to get the most out of SCSI, including how to configure it on a workstation or server. This book can be used as both a desktop reference as well as a guide to configuring SCSI. Included are troubleshooting tips and tricks for getting SCSI devices configured on a network as well as information about the role of SCSI in network-based storage. Exploring the World of SCSI will provide both technicians and administrators with assistance in defining network topology issues.
Failure Mode and Effects Analysis (FMEA)
You will learn how to prepare and utilize FMEA to improve reliability, safety, testability, and maintainability. This course will describe FMEA methodology and its multiple uses for a more reliable, testable and maintainable product.
Fault-Tolerance and Reliability Techniques for High-Density Random-Access Memories
From PDAs to supercomputers, cell phones to video games, every modern electronic system contains memory -- most often, RAM. As engineers seek to increase the power and capacity of these systems, they are introducing advanced new nanofabrication CMOS technologies. In these environments, today's processing techniques are no longer sufficient to produce high-yield wafers. To improve RAM reliability without compromising performance, cost, or space requirements, engineers are turning to advanced fault-tolerant techniques. This is the first book to survey the state-of-the-art in memory fault tolerance. KEY TOPICS:The authors survey the latest research and new field-proven techniques for reliable and fault-tolerant RAM circuit design and evaluation, placing these advances in the context of the field's progress over the past two decades. They examine both manufacturing fault-tolerance (e.g. self-repair at the time of manufacturing) and online and field-related fault-tolerance (e.g. error-correction). The book presents in-depth discussions of each key requirement for RAM design, and each key technique -- including rationale, advantages, disadvantages, design flow, implementation, and results. MARKET: For every professional concerned with VLSI/memory circuit design, testing, and reliability, including semiconductor and VLSI design and test engineers and other design team members working in industry; engineers working on SOC (system-on-a-chip) and embedded products; and electrical engineering researchers and advanced students throughout academia.
High Performance Memory Testing: Design Principles, Fault Modeling and Self-Test
Design and test are considered jointly in this book since knowledge of one without the other is insufficient for the task of having high quality memories. Knowledge of memory design is required to understand test. An understanding of test is required to have effective built-in self-test implementations. A poor job can be done on any of these pieces resulting in a memory that passes test but which is not actually good. The relentless press of Moore's law drives more and more bits onto a single chip. The large number of bits means that methods that were "gotten away with" in the past will no longer be sufficient. Because the number of bits is so large, fine nuances of fails that were rarely seen previously now will happen regularly on most chips. These subtle fails must be caught or else quality will suffer severely. Are memory applications more critical than they have been in the past? Yes, but even more critical is the number of designs and the sheer number of bits on each design. It is assured that catastrophes, which were avoided in the past because memories were small, will easily occur if the design and test engineers do not do their jobs very carefully. High Performance Memory Testing: Design Principles, Fault Modeling and Self Test is based on the author's 20 years of experience in memory design, memory reliability development and memory self test. High Performance Memory Testing: Design Principles, Fault Modeling and Self Test is written for the professional and the researcher to help them understand the memories that are being tested.
Integrated Diagnostics and Artificial Intelligence
How integrated diagnostics and artificial intelligence (AI) can be used to improve product support. You will learn the basic principals of artificial intelligence and how they apply to test and diagnosis. You will also learn diagnostic concepts, including dependency modeling and optimizations.
Introduction to IDDQ Testing
Testing techniques for VLSI circuits are undergoing many exciting changes. The predominant method for testing digital circuits consists of applying a set of input stimuli to the IC and monitoring the logic levels at primary outputs. If, for one or more inputs, there is a discrepancy between the observed output and the expected output then the IC is declared to be defective. A new approach to testing digital circuits, which has come to be known as IDDQ testing, has been actively researched for the last fifteen years. In IDDQ testing, the steady state supply current, rather than the logic levels at the primary outputs, is monitored. Years of research suggests that IDDQ testing can significantly improve the quality and reliability of fabricated circuits. This has prompted many semiconductor manufacturers to adopt this testing technique, among them Philips Semiconductors, Ford Microelectronics, Intel, Texas Instruments, LSI Logic, Hewlett-Packard, SUN microsystems, Alcatel, and SGS Thomson. This increase in the use of IDDQ testing should be of interest to three groups of individuals associated with the IC business: Product Managers and Test Engineers, CAD Tool Vendors and Circuit Designers. Introduction to IDDQ Testing is designed to educate this community. The authors have summarized in one volume the main findings of more than fifteen years of research in this area.
Microelectronic Reliability, Vol 1
Let twelve specialists show you how to test, analyze, and achieve better microelectronic reliability of silicon and GaAs devices. Microelectronic Reliability, Volume I: Reliability, Test, and Diagnostics offers you detailed, original works on the topics most vital to both device and equipment reliability and manufacturing yield. Broad enough to serve as an effective textbook and in-depth enough for practicing engineers, this text also makes an ideal reference for managers who need a quick overview of current reliability, test, and failure analysis issues. Supported by 600 references, 147 figures, and 39 tables, this encyclopedic guide shows you how to identify the thermal, chemical, and mechanical processes that influence the incidence and severity of failure mechanisms. This coverage outlines techniques for assessing the susceptibility to failure of various devices. Detailing the theory and operation of current failure analysis tools, the text also gives you instrument price ranges and example analyses. Combined with the sweeping overview and comprehensive bibliography found in Microelectronic Reliability Volume II, this text gives you the only source you need to meet today's ever-improving standards for quality and reliability of advanced microelectronic technology. Contents: Preface. Introduction. Statistical Aspects for Reliability. Failure Mechanisms in Microelectronic Devices. Testability for Functional Verification and Diagnostics. Automatic Testing. Manufacturing Process Control. GaAs Reliability and Test. Appendix A: Advanced Failure Analysis Instrumentation. List of Acronyms. Glossary. Index.
On Line-Testing for VLSI
Test functions (fault detection, diagnosis, error correction, repair, etc.) that are applied concurrently while the system continues its intended function are defined as on-line testing. In its expanded scope, on-line testing includes the design of concurrent error checking subsystems that can be themselves self-checking, fail-safe systems that continue to function correctly even after an error occurs, reliability monitoring, and self-test and fault-tolerant designs. On-Line Testing for VLSI contains a selected set of articles that discuss many of the modern aspects of on-line testing as faced today. The contributions are largely derived from recent IEEE International On-Line Testing Workshops. Guest editors Michael Nicolaidis, Yervant Zorian and Dhiraj Pradhan organized the articles into six chapters. In the first chapter the editors introduce a large number of approaches with an expanded bibliography in which some references date back to the sixties. On-Line Testing for VLSI is an edited volume of original research comprising invited contributions by leading researchers.
Optimizing Electronics Vibration HALT, HASS, ALT and ESS
A three-day interactive workshop aimed at shortening the time required for electronics design, vibration testing and (when weaknesses are found) corrective action. This course applies to vibration of electronics at system, box or circuit card level. Methods can also be used in the design and testing of electronic components to meet vibration standards or desired capabilities. Discussion of simple methods and animations assist participants understand the complex responses of their electronics to laboratory and to field vibration. "Vibration test efficiency" is a new term, used here to illustrate recent improvements over the past slow "learning curve" for vibration knowledge. Since vibration life of most electronics is dependent on response at circuit card level, methods concentrate on the fatigue damage from PCB modal response. The purpose of this course is to simplify the complex field of vibration of electronics and make results understandable. 1% Efficiency? Tests can determine fragility limits of test samples. But few tests supply any further information (beyond pass/fail). Why? Because test measurements can't fully describe failures. Most tests miss most of the valuable information that is (with this course) readily available. Early Attempts In the 70's and 80's, relatively simple mathematical methods were developed to predict PCB vibration life capabilities. Why? Because few companies could afford that era's high-speed computer systems and the technical expertise needed to analyze vibration. Those early methods, still used by many, provide guidelines that sometimes work, but they never provide product understanding. And all too often, such guidelines outright fail, at great expense - the expense of design and production of an unreliable product. But since then, the cost of high-speed computer power has dropped at a rate of about 50% per year. The compounded cost savings of the mid 80's high-speed computer is over 99.99%. One of the best-kept secrets of certain large companies is their ability to produce reliable electronic products at low cost. How? They are able to fully understand vibration of their electronics through detailed analysis. Such companies rarely share their reliability secrets with competitors. But now, with this course, every company can afford high speed analysis support of its testing. Test Efficiency? Let's define test efficiency as dollar value of information gained divided by dollars of test cost. If you run a test program without analysis, your numerator is near zero. Adding modern technology analysis can immeasurably increase your "information gained" numerator. Every test performed without detailed posttest analysis throws information away and wastes money. Rather than throw it away, capture that information and use it to save many design and production problems. Detailed Analysis? The "design life" of any system is defined by its weakest part based on the part's local exposure. Since vibration damage of circuit cards is dominated by cyclic stresses (caused by modal vibration), analysis should concentrate on accurately quantifying the stresses experienced by every component. Design life is limited by accumulated fatigue damage. Taking advantage of the speed of today's PCs, companies without prior experience can use this course to understand and avoid vibration-induced failures. For DATES AND LOCATIONS see
Power-Constrained Testing of VLSI Circuits
Minimization of power dissipation in very large scale integrated (VLSI) circuits is important to improve reliability and reduce packaging costs. While many techniques have investigated power minimization during the functional (normal) mode of operation, it is important to examine the power dissipation during the test circuit activity is substantially higher during test than during functional operation. For example, during the execution of built-in self-test (BIST) in-field sessions, excessive power dissipation can decrease the reliability of the circuit under test due to higher temperature and current density. Power-Constrained Testing of VLSI Circuits focuses on techniques for minimizing power dissipation during test application at logic and register-transfer levels of abstraction of the VLSI design flow. The first part of this book surveys the existing techniques for power constrained testing of VLSI circuits. In the second part, several test automation techniques for reducing power in scan-based sequential circuits and BIST data paths are presented.
Product Assurance Technologies - Originally Published as "Assurance Technologies"
This is a hands-on book for design practitioners for designing reliability, maintainability, safety, quality, human factors, and logistics into the product. This is the first book to combine all the design assurance principles in one volume. It was on McGraw-Hill's best seller list for three years and is recommended by the System \Safety Society, Society of Logistics Engineers and American Society for Quality.
Random Vibration, Shock Testing, HALT, ESS, HASS Measurements, Analysis and Calibration
Upon completion of this short course, you will be able to measure vibration and shock, calibrate vibration and shock measurement systems, convert measured data into a test program, interpret vibration and shock test requirements, conduct vibration and shock tests, design suitable vibration and shock test fixtures.
Software Design for Testability (SDFT)
The latest theory and practice of Software Design for Testability (SDFT) will be explained, primarily through comparisons and analogies to the well-established discipline of hardware DFT.
Software Test, Reliability and Quality Assurance
You will get practical answers to the following questions: When should you start testing and when can you stop testing? How do you predict software bug rates? Which defects are acceptable and why? What software metrics should be collected to measure testing progress? How do you plan for testing, debugging, and fixing software? What can you look for in code to verify that software reliability has been designed into the software? This course prepares you to create better software and to evaluate software produced by others.
Standards in Test
You will be introduced to most of the Military and Commercial Standards that affect the way test is performed and interpreted by both military and commercial concerns.
Test Engineering: A Concise Guide to Cost-effective Design, Development and Manufacture
Testing is usually the most expensive, time-consuming and difficult activity during the development of engineering products and systems. Development testing must be performed to ensure that designs meet requirements for performance, safety, durability, reliability, statutory aspects, etc. Most manufactured items must be tested to ensure that they are correctly made. However, much of the testing that is performed in industry is based upon traditions, standards and procedures that do not provide the optimum balance of assurance versus cost and time. There is often pressure to reduce testing because of the high costs involved, without appreciation of the effects on performance, reliability. etc. Misperceptions are commonplace, particularly the idea that tests should not stress products in excess of their operating levels. The main reason for this situation seems to be that engineers have not developed a consistent philosophy and methodology for testing. Testing is seldom taught as part of engineering curricula, and there are no books on the subject. Specialist areas are taught, for example fatigue testing to mechanical engineers and digital device testing to electronics engineers. However, a wide range is untaught, particularly multidisciplinary and systems aspects. Testing is not just an engineering issue. Because of the importance and magnitude of the economic and business aspects testing is an issue for management. Testing is perceived as a high cost activity, when it should be considered as a value-adding process. The objective of this book is, therefore, to propose a philosophy of engineering test and to describe the necessary technologies and methods that will provide a foundation for all plans, methods and decisions related to testing of engineered products and systems. The book will help those who must manage and conduct this most difficult and uncertain task. It will also provide a text, which can be used as the basis for teaching the principles of testing to all engineering students.
Test System Design: A Systematic Approach
The only expert guide to designing and implementing custom test systems Best practices for the entire lifecycle: planning through upgrades Maximizing accuracy, reliability, and usability(and protecting against obsolescence THE ONLY EXPERT GUIDE TO DESIGNING AND IMPLEMENTING CUSTOM TEST SYSTEMS More and more engineers now face the challenges of electronic testing(and those challenges are becoming more complex each year. In Test System Design: A Systematic Approach, three expert testing professionals offers start-to-finish best practices for designing, developing, and implementing custom test systems. Ideal for both engineers who are creating test systems and those contracting the responsibility to third parties, this book covers the entire system lifecycle, from planning to upgrades, and beyond. Designing, developing, and implementing more effective test systems(from start to finish Protecting against obsolescence through planned upgrades and open standards Simplifying development, minimizing risk, and maximizing accuracy and reliability Building systems that fit the skills of your operators Expert implementation: interfaces, cabling, switch panels, electrical safety, racking, temperature control, and more Discover proven techniques for evaluating your testing requirements, eliminating redundant tests, and determining exactly which equipment you really need. Compare your options for sourcing test equipment, and learn how to maximize the value of every supplier relationship. Learn better solutions for documenting your test systems, training your operators, streamlining your maintenance programs, and more. No matter what your testing challenges are, Test System Design is your comprehensive resource for achieving them faster and more cost effectively.
Testing and Testable Design of High-Density Random-Access Memories
Testing and Testable Design of High-Density Random-Access Memories deals with the study of fault modeling, testing and testable design of semiconductor random-access memories. It is written primarily for the practicing design engineer and the manufacturer of random-access memories (RAMs) of the modern age. It provides useful exposure to state-of-the-art testing schemes and testable design approaches for RAMs. It is also useful as a supplementary text for undergraduate courses on testing and testability of RAMs. Testing and Testable Design of High-Density Random-Access Memories presents an integrated approach to state-of-the-art testing and testable design techniques for RAMs. These new techniques are being used for increasing the memory testability and for lowering the cost of test equipment. Semiconductor memories are an essential component of digital computers - they are used as primary storage devices. They are used in almost all home electronic equipment, in hospitals and for avionics and space applications. From hand-held electronic calculators to supercomputers, we have seen generations of memories that have progressively become smaller, smarter and cheaper. For the past two decades there has been vigorous research in semiconductor memory design and testing. Such research has resulted in bringing the dynamic RAM (DRAM) to the forefront of the microelectronics industry in terms of achievable integration levels, high performance, high reliability, low power and low cost. The DRAM is regarded as the technological driver for the commercial microelectronics industry. Testing and Testable Design of High-Density Random-Access Memories deals with real- world examples that will be useful to readers. This book also provides college and university students with a systematic exposure to a wide spectrum of issues related to RAM testing and testable design.
WebCourse - Design for Testability 401 - System Level Testability and Diagnosability
For system level, testability isn't only failure detection. You need to concern yourself with repair and before that can happen, you need to accurately and unambigously determine the root cause of the system failure. That root cause should involve a single replaceable subsystem or board in nearly all cases. You will learn how to approach this in a logical fashion.
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